Month: August 2022

AMD Announces Ryzen 7000 Reveal Livestream for August 29th
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AMD Announces Ryzen 7000 Reveal Livestream for August 29th

In a brief press release sent out this morning, AMD has announced that they will be delivering their eagerly anticipated Ryzen 7000 unveiling later this month as a live stream. In an event dubbed “together we advance_PCs”, AMD will be discussing the forthcoming Ryzen 7000 series processors as well as the underlying Zen 4 architecture...

Improving on Expandable CPU Cooling
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Improving on Expandable CPU Cooling

Many businesses devoted to the design and delivery of liquid cooling systems for PCs were established when the trend of liquid cooling emerged in the 1990’s. One of them was Alphacool, a German business that expanded their product lines to include liquid coolers for use in both industrial and medical applications. Using liquid-based cooling systems...

Alder Lake-P and Cezanne UCFF Faceoff
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Alder Lake-P and Cezanne UCFF Faceoff

The past few years have seen Intel and AMD delivering new processors in a staggered manner. In the sub-45W category, Intel’s incumbency has allowed it to deliver products for both the notebook and ultra-compact form factor (UCFF) within a few months of each other. On the other hand, AMD’s focus has been on the high-margin...

UCIe Consortium Incorporates, Adds NVIDIA and Alibaba As Members
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UCIe Consortium Incorporates, Adds NVIDIA and Alibaba As Members

Among the groups with a presence at this year’s Flash Memory Summit is the UCIe Consortium, the recently formed group responsible for the Universal Chiplet Interconnect Express (UCIe) standard. First unveiled back in March, the UCIe Consortium is looking to establish a universal standard for connecting chiplets in future chip designs, allowing chip builders to...

SK hynix Announces 238 Layer NAND
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SK hynix Announces 238 Layer NAND

As the 2022 Flash Memory Summit continues, SK hynix is the latest vendor to announce their next generation of NAND flash memory at the show. Showcasing for the first time the company’s forthcoming 238 layer TLC NAND, which promises both improved density/capacity and improved bandwidth. At 238 layers, SK hynix has, at least for the...

Taking Another Shot at QLC With Cache Tiering
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Taking Another Shot at QLC With Cache Tiering

Although Intel is no longer directly in the SSD market these days, their SSD team and related technologies continue to live on under the SK hynix umbrella as Solidigm. Since their initial formation at the very end of 2021, Solidigm has been in the process of reestablishing their footing, continuing to sell and support Intel’s...

Which Adobe Creative Cloud pricing tier is best for you
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Which Adobe Creative Cloud pricing tier is best for you

Adobe Creative Cloud If you’re feeling confused about Adobe’s pricing models, you’re not alone. Here’s which tier is aimed at which market segment, precisely what you get when you subscribe to Adobe’s Creative Cloud. How Adobe handles subscriptions Before we delve into the prices for Adobe subscriptions, let us take a moment to explain...

Doubled Speeds and Flexible Fabrics
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Doubled Speeds and Flexible Fabrics

While it’s technically still the new kid on the block, the Compute Express Link (CXL) standard for host-to-device connectivity has quickly taken hold in the server market. Designed to offer a rich I/O feature set built on top of the existing PCI-Express standards – most notably cache-coherency between devices – CXL is being prepared for...

U.3 PCIe 4.0 x4 with 128L eTLC
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U.3 PCIe 4.0 x4 with 128L eTLC

Phison and Seagate have been collaborating on SSDs since 2017 in the client as well as SMB/SME space. In April 2022, they had announced a partnership to develop and distribute enterprise NVMe SSDs. At the Flash Memory Summit this week, the results of the collaboration are being announced in the form of the X1 SSD...

OpenCAPI to Fold into CXL
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OpenCAPI to Fold into CXL

With the 2022 Flash Memory Summit taking place this week, not only is there a slew of solid-state storage announcements in the pipe over the coming days, but the show is also increasingly a popular venue for discussing I/O and interconnect developments as well. Kicking things off on that front, this afternoon the OpenCAPI and...